GENEVA, Feb. 3 -- SHINPO CO., LTD. (110, Wakabadai, Meito-ku Nagoya-shi, Aichi4650015), シンポ株式会社 (愛知県名古屋市名東区若葉台１１０番地) filed a patent application (PCT/JP2023/027473) for "REMOVAL METHOD AND REMOVAL SYSTEM" on Jul 27, 2023. With publication no. WO/2025/022630, the details related to the patent application was published on Jan 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ASAKAWA Tomoya (c/o SHINPO CO., LTD., 110, Wak...