GENEVA, Nov. 24 -- SHINKAWA LTD. (51-1, Inadaira 2-chome, Musashimurayama-shi, Tokyo2088585), 株式会社新川 (東京都武蔵村山市伊奈平２丁目５１番地の１) filed a patent application (PCT/JP2025/013472) for "BONDING STAGE" on Apr 02, 2025. With publication no. WO/2025/239044, the details related to the patent application was published on Nov 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SEKIGUCHI Shigeyuki (c/o SHINKAWA LTD., 51-1, Inadai...