GENEVA, May 13 -- SHINKAWA LTD. (51-1, Inadaira 2-chome, Musashimurayama-shi, Tokyo2088585), 株式会社新川 (東京都武蔵村山市伊奈平２丁目５１番地の１) filed a patent application (PCT/JP2024/038259) for "BONDING DEVICE, METHOD, AND PROGRAM" on Oct 28, 2024. With publication no. WO/2025/094865, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YOSHIHARA Akinori (c/o SHINKAWA...