GENEVA, Aug. 11 -- SHIN-ETSU ENGINEERING CO., LTD. (9, Kanda-nishiki-cho 2-chome, Chiyoda-ku, Tokyo1010054), 信越エンジニアリング株式会社 (東京都千代田区神田錦町２丁目９番地) filed a patent application (PCT/JP2024/003543) for "ABLATION PROCESSING METHOD, ABLATION PROCESSING DEVICE, AND SUBSTRATE" on Feb 02, 2024. With publication no. WO/2025/163906, the details related to the patent application was published on Aug 07, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Worl...