GENEVA, Feb. 10 -- SHIN-ETSU CHEMICAL CO., LTD. (4-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1000005), 信越化学工業株式会社 (東京都千代田区丸の内一丁目４番１号) filed a patent application (PCT/JP2025/026183) for "TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE, AND METHOD FOR PRODUCING THIN WAFERS" on Jul 24, 2025. With publication no. WO/2026/028906, the details related to the patent application was published on Feb 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual P...