GENEVA, July 8 -- SHIMA SEIKI MFG., LTD. (85, Sakata, Wakayama-shi, Wakayama6418511), 株式会社島精機製作所 (和歌山県和歌山市坂田８５番地) filed a patent application (PCT/JP2024/044283) for "WIRE CONNECTION STRUCTURE" on Dec 13, 2024. With publication no. WO/2025/142567, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KOSUI Tatsuya (c/o SHIMA SEIKI MFG., LTD., 85, Sakata, Wakayama-...