GENEVA, June 12 -- SHI, Weitao (25 Willow LnGreat Neck, New York 11023) filed a patent application (PCT/US2024/057783) for "MODULAR BUILDING PLATFORM AND ASSEMBLY METHOD THEREOF" on Nov 27, 2024. With publication no. WO/2025/117766, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SHI, Weitao (25 Willow LnGreat Neck, New York 11023)
Abstract:
The present invention provides a prefabricated building structure, a building assembled with the prefabricated building structure, and its method for assembly. In one embodiment, s...