INTERNATIONAL PATENT: SHENZHEN TCL NEW TECHNOLOGY CO., LTD. FILES APPLICATION FOR "MULTI-HOP SIDELINK RELAY METHOD, USER EQUIPMENT AND A BASE STATION"

GENEVA, March 23 -- SHENZHEN TCL NEW TECHNOLOGY CO., LTD. (Building D4, TCL International E City No. 1001, Zhongshan Park Road, Xili Street, Nanshan DistrictShenzhen, Guangdong 518052) filed a patent application (PCT/CN2023/118928) for "MULTI-HOP SIDELINK RELAY METHOD, USER EQUIPMENT AND A BASE STATION" on Sep 14, 2023. With publication no. WO/2025/054927, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Zhe (Building D4, TCL International E City No. 1001, Zhongshan Park Road, Xili Street, Nanshan DistrictShenzhen, G...