INTERNATIONAL PATENT: SHENZHEN TCL NEW TECHNOLOGY CO., LTD. FILES APPLICATION FOR "METHOD OF VRB-TO-PRB INTERLEAVER, MEASUREMENT REPORT AND SUBBAND PARTITION FOR SBFD OPERATION AND RELATED DEVICES"

GENEVA, Feb. 24 -- SHENZHEN TCL NEW TECHNOLOGY CO., LTD. (Building D4, TCL International E City No. 1001, Zhongshan Park Road, Xili Street, Nanshan DistrictShenzhen, Guangdong 518052) filed a patent application (PCT/CN2023/112747) for "METHOD OF VRB-TO-PRB INTERLEAVER, MEASUREMENT REPORT, AND SUBBAND PARTITION FOR SBFD OPERATION AND RELATED DEVICES" on Aug 11, 2023. With publication no. WO/2025/035320, the details related to the patent application was published on Feb 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIU, Kai (Building D4, TCL International E City No. 1001, Zhongshan Park ...