INTERNATIONAL PATENT: SHENZHEN JINGYANG ELECTRONICS CO., LTD, 深圳市晶扬电子有限公司 FILES APPLICATION FOR "LDMOS POWER CHIP PACKAGING STRUCTURE UNDER LARGE-SCALE ARRAY"

GENEVA, Feb. 20 -- SHENZHEN JINGYANG ELECTRONICS CO., LTD (Rm.1601-1602, Tower A, Bldg 8, The International Innovation Valley the Cloud City of Shenzhen Vanke, Nanshan DistrictShenzhen, Guangdong 518000), 深圳市晶扬电子有限公司 (中国广东省深圳市南山区万科云城国际创新谷8栋A座1601-1602室) filed a patent application (PCT/CN2024/130060) for "LDMOS POWER CHIP PACKAGING STRUCTURE UNDER LARGE-SCALE ARRAY" on Nov 06, 2024. With publication no. WO/2026/036533, the details related to the patent application was published on Feb 19, 2026.

Notably, the...