INTERNATIONAL PATENT: SHEN, YUCI FILES APPLICATION FOR "3D COOLING BLOCK FOR HEAT DISSIPATION IN ELECTRONIC DEVICES"

GENEVA, Sept. 17 -- SHEN, Yuci (192 Teasel CmnLivermore, CA 94551) filed a patent application (PCT/US2024/032674) for "3D COOLING BLOCK FOR HEAT DISSIPATION IN ELECTRONIC DEVICES" on Jun 05, 2024. With publication no. WO/2025/188338, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHEN, Yuci (192 Teasel CmnLivermore, CA 94551)

Abstract: The disclosure describes a 3D (3-dimensional) water block for cooling a heat source of an electronic system such as a semiconductor chip package, comprising: a box with a base plate, a ...