INTERNATIONAL PATENT: SHANGHAI XIZHI TECHNOLOGY CO., LTD., 上海曦智科技有限公司 FILES APPLICATION FOR "OPTICAL INTERCONNECT, CHIP PACKAGE, COMPUTING SYSTEM AND ARTIFICIAL INTELLIGENCE DEVICE"

GENEVA, May 11 -- SHANGHAI XIZHI TECHNOLOGY CO., LTD. (Building 3, No. 696, Songtao Road, China (Shanghai) Pilot Free Trade Zone,Pudong New Area, Shanghai 201203), 上海曦智科技有限公司 (中国上海市浦东新区中国(上海)自由贸易试验区松涛路696号3幢) filed a patent application (PCT/CN2024/127682) for "OPTICAL INTERCONNECT, CHIP PACKAGE, COMPUTING SYSTEM, AND ARTIFICIAL INTELLIGENCE DEVICE" on Oct 28, 2024. With publication no. WO/2025/092647, the details related to the patent application was published on May 08, 2025.

Notably, the patent ap...