GENEVA, Feb. 15 -- SHANGHAI SILVER PASTE SCI. &TECH. CO., LTD. (Building 7, No. 199, Guangfulin East Road,Songjiang District, Shanghai 201613), 上海银浆科技有限公司 (中国上海市松江区广富林东路199号7幢) filed a patent application (PCT/CN2023/131140) for "HIGH-PERFORMANCE CONDUCTIVE SILVER-ALUMINUM PASTE AND PREPARATION METHOD THEREFOR, ELECTRODE AND N-TYPE TOPCON BATTERY" on Nov 11, 2023. With publication no. WO/2025/030701, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (I...