INTERNATIONAL PATENT: SHANGHAI RADIALL ELECTRONICS CO., LTD., RADIALL SA FILES APPLICATION FOR "A CYLINDRICAL CONTACT AND A HIGH DENSITY MULTI-CONTACT RF CONNECTOR COMPRISING MEANS FOR EASY AND QUICK INSTALLING/REMOVING WITH LOCKING EACH CONTACT IN ITS INSTALLED POSITION"

GENEVA, Jan. 25 -- SHANGHAI RADIALL ELECTRONICS CO., LTD. (No. 688 Hui Fang RoadJiading District, Shanghai 201806), RADIALL SA (25 rue Madeleine Vionnet,93300 Aubervilliers) filed a patent application (PCT/CN2024/106138) for "A CYLINDRICAL CONTACT AND A HIGH DENSITY MULTI-CONTACT RF CONNECTOR COMPRISING MEANS FOR EASY AND QUICK INSTALLING/REMOVING WITH LOCKING EACH CONTACT IN ITS INSTALLED POSITION" on Jul 18, 2024. With publication no. WO/2026/016119, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Gong (No. 688 Hu...