GENEVA, May 4 -- SHANGHAI LAIMU ELECTRONICS CO., LTD (No. 7319 Zhong Chun RoadMinhang District, Shanghai 201619), 上海徕木电子股份有限公司 (中国上海市闵行区中春路7319号) filed a patent application (PCT/CN2024/119930) for "THREE-DIMENSIONAL RECONSTRUCTION METHOD BASED ON LIDAR AND VISION MULTI-INFORMATION FUSION" on Sep 20, 2024. With publication no. WO/2025/086950, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Or...