INTERNATIONAL PATENT: SHANGHAI JIAO TONG UNIVERSITY, 上海交通大学 FILES APPLICATION FOR "MICRO-BUMP LASER PRINTING METHOD FOR PACKAGING THREE-DIMENSIONAL INTEGRATED CIRCUIT"

GENEVA, May 25 -- SHANGHAI JIAO TONG UNIVERSITY (No. 800, Dongchuan Rd.Minhang District, Shanghai 200240), 上海交通大学 (中国上海市闵行区东川路800号) filed a patent application (PCT/CN2024/124842) for "MICRO-BUMP LASER PRINTING METHOD FOR PACKAGING THREE-DIMENSIONAL INTEGRATED CIRCUIT" on Oct 15, 2024. With publication no. WO/2025/103045, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HU, Yongxiang (No. 800, Dongch...