INTERNATIONAL PATENT: SENIC INC., 주식회사 쎄닉 FILES APPLICATION FOR "METHOD FOR EVALUATING WAFER AND WAFER MANUFACTURED USING SAME"

GENEVA, June 3 -- SENIC INC. (17-15, 4sandan 7-ro, Jiksan-eup, Seobuk-guCheonan-siChungcheongnam-do 31040), 주식회사 쎄닉 (충청남도천안시서북구 직산읍 4산단7로 17-15) filed a patent application (PCT/KR2024/012390) for "METHOD FOR EVALUATING WAFER AND WAFER MANUFACTURED USING SAME" on Aug 21, 2024. With publication no. WO/2025/110418, the details related to the patent application was published on May 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, In Gyu...