INTERNATIONAL PATENT: SEMILEDS CORPORATION FILES APPLICATION FOR "METHODS FOR FABRICATING SEMICONDUCTOR DEVICES BY FORMING AND REMOVING EPITAXIAL (EPI) STRUCTURES FROM AN ENGINEERED SUBSTRATE"

GENEVA, May 28 -- SEMILEDS CORPORATION (3F, No. 11, Ke Jung Rd.Chu-Nan Site, Hsinchu Science ParkChu-Nan, Miao-Li County 350) filed a patent application (PCT/US2024/054829) for "METHODS FOR FABRICATING SEMICONDUCTOR DEVICES BY FORMING AND REMOVING EPITAXIAL (EPI) STRUCTURES FROM AN ENGINEERED SUBSTRATE" on Nov 07, 2024. With publication no. WO/2025/106324, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DOAN, Trung Tri (No. 1, Ln. 38, Songcui Rd.Baoshan TownshipHsinchu County 308), CHU, Chen-fu (No. 19, Aly. 2, Ln. 239, M...