GENEVA, Nov. 4 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5701 N. Pima RoadScottsdale, Arizona 85250) filed a patent application (PCT/US2024/039657) for "SINTERING FOR SEMICONDUCTOR DEVICE ASSEMBLIES" on Jul 25, 2024. With publication no. WO/2025/226289, the details related to the patent application was published on Oct 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YAN, Hao (No. 218 LuCheng RoadYuShan Town of Kun ShanSuzhou, Jiangsu 215300), FENG, Kun (No. 1509, Shuangdan RoadShanghai, Shanghai 201800), YANG, Yan (Suzhou Loufeng Street of GuSu DistrictSuzhou, Jiangsu 215300), YU, Guo...