INTERNATIONAL PATENT: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC FILES APPLICATION FOR "SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE"

GENEVA, Oct. 28 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5701 N. Pima RoadScottsdale, Arizona 85250) filed a patent application (PCT/US2024/039661) for "SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE" on Jul 25, 2024. With publication no. WO/2025/221281, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JI, Sixin (YuXianHuaYuan#99 DongGao RoadNanTong, Jiangsu 226000), LEE, Keunhyuk (Horizon-R 30-1501, SIPSuzhou, Jiangsu 215021), CHANG, Jie (Building 2, room 703ZhongNanHuaYuanSuzhou, Jiangsu 215021), YUAN, XiaoY...