INTERNATIONAL PATENT: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC FILES APPLICATION FOR "LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING"

GENEVA, April 1 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5701 N. Pima RoadScottsdale, Arizona 85250) filed a patent application (PCT/US2024/010043) for "LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING" on Jan 02, 2024. With publication no. WO/2025/063993, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): EOM, Jooyang (22 Gimpohangang 7-ro 22beon-gil504-701Gimpo-siGyeonggi-do 10067), YOO, Inpil (Bonhoefferstrasse 482008 Unterhaching), IM, Seungwon (261 GYENAM-RO CHUNGDONG DAERIM102-704BucheonGyeong...