INTERNATIONAL PATENT: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC FILES APPLICATION FOR "FLUID-COOLED POWER MODULE"

GENEVA, Nov. 4 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5701 N. Pima RoadScottsdale, Arizona 85250) filed a patent application (PCT/US2024/027990) for "FLUID-COOLED POWER MODULE" on May 06, 2024. With publication no. WO/2025/226282, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIM, Seokbong (516-701, 70, Hanbit-roPaju-siGyeonggi-do 10908), LEE, Byoungok (Lotte Cattle Campus Town APT, 106-300355, SongdoGwahak-ro, 27beon-gilYeonsu-guIncheon 21982), LIU, Yong (1 Ebb Tide DriveCumberland Foreside, Maine 04110)

Abstrac...