INTERNATIONAL PATENT: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC FILES APPLICATION FOR "DEVICE PACKAGE HAVING A CAVITY WITH SLOPED SIDEWALLS"

GENEVA, Nov. 25 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5701 N. Pima RoadScottsdale, Arizona 85250) filed a patent application (PCT/US2025/026266) for "DEVICE PACKAGE HAVING A CAVITY WITH SLOPED SIDEWALLS" on Apr 24, 2025. With publication no. WO/2025/240098, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHARMA, Ankit Bhushan (Rennweg 4385435 Erding), ZSCHIESCHANG, Olaf (Vogelsangstrasse 874889 Sinsheim)

Abstract: A semiconductor device package (100, 200a, 200b) may include a conductive member (101, 201) having a ...