INTERNATIONAL PATENT: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC FILES APPLICATION FOR "COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS"

GENEVA, Feb. 18 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5701 N. Pima RoadScottsdale, Arizona 85250) filed a patent application (PCT/US2024/025804) for "COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS" on Apr 23, 2024. With publication no. WO/2025/034268, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BRIZAR, Guy (Bavegemstraat 209860 Oosterzele), SEDDON, Michael (2760 E. Milky WayGilbert, Arizona 85295)

Abstract: Implementations of a method of forming an interconnect may include forming a seed layer (10) ove...