INTERNATIONAL PATENT: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC FILES APPLICATION FOR "COOLER ASSEMBLY FOR ELECTRONIC MODULES"

GENEVA, Dec. 16 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5701 N. Pima RoadScottsdale, Arizona 85250) filed a patent application (PCT/US2024/050502) for "COOLER ASSEMBLY FOR ELECTRONIC MODULES" on Oct 09, 2024. With publication no. WO/2025/254676, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YAO, Zhaoxi (101 Lords LnLyman, Maine 04002), LIU, Yong (1 Ebb Tide DriveCumberland Foreside, Maine 04110)

Abstract: An illustrative cooler assembly (100) may include an inlet (104), an outlet (106), a cooling channel (122), an...