INTERNATIONAL PATENT: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC FILES APPLICATION FOR "COMPACT SEMICONDUCTOR PACKAGING USING A LEADLESS DISCRETE COMPONENT"

GENEVA, Dec. 16 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5701 N. Pima RoadScottsdale, Arizona 85250) filed a patent application (PCT/US2024/050550) for "COMPACT SEMICONDUCTOR PACKAGING USING A LEADLESS DISCRETE COMPONENT" on Oct 09, 2024. With publication no. WO/2025/254677, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PARK, JeongHyuk (163, Cheongna canal-ro, Seo-guIncheonIncheon 22764), HAN, Gyuwan (860, Namdong-daero, Namdong-guIncheonIncheon 21548), LEE, Keunhyuk (Horizon-R 30-1501, SIPSuzhou, Jiangsu 215021)

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