GENEVA, Oct. 19 -- SEKISUI CHEMICAL CO., LTD. (4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka5308565), 積水化学工業株式会社 (大阪府大阪市北区西天満２丁目４番４号) filed a patent application (PCT/JP2025/012430) for "ELECTROCONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE" on Mar 27, 2025. With publication no. WO/2025/216077, the details related to the patent application was published on Oct 16, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the ...