GENEVA, Jan. 13 -- SEKISUI CHEMICAL CO., LTD. (4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka5308565), 積水化学工業株式会社 (大阪府大阪市北区西天満２丁目４番４号) filed a patent application (PCT/JP2025/022628) for "ELECTRICALLY CONDUCTIVE PASTE, RFID INLAY, AND METHOD FOR PRODUCING RFID INLAY" on Jun 24, 2025. With publication no. WO/2026/009765, the details related to the patent application was published on Jan 08, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Pr...