INTERNATIONAL PATENT: SCHUNK SONOSYSTEMS GMBH FILES APPLICATION FOR "METHOD FOR ELECTRICALLY CONNECTING A METAL ELEMENT TO A MULTI-LAYER COMPOSITE PRINTED CIRCUIT BOARD BY MEANS OF ULTRASONIC WELDING"

GENEVA, Dec. 15 -- SCHUNK SONOSYSTEMS GMBH (HauptstraBe 9535435 Wettenberg) filed a patent application (PCT/EP2024/065434) for "METHOD FOR ELECTRICALLY CONNECTING A METAL ELEMENT TO A MULTI-LAYER COMPOSITE PRINTED CIRCUIT BOARD BY MEANS OF ULTRASONIC WELDING" on Jun 05, 2024. With publication no. WO/2025/252303, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HANIKA, Tim (Blauackerweg 3535428 Langgons), KENEDER, Mathis (Kirschgartener Str. 3035325 Mucke), HOLLAND, Morris (Wiesecker Weg 1035396 GieBen), KROMM, Sebastian (R...