INTERNATIONAL PATENT: SCHAEFFLER TECHNOLOGIES AG & CO. KG FILES APPLICATION FOR "THERMAL MODULE, INDIRECT HEAT TRANSPORT MEDIUM CIRCUIT (CYCLE) SYSTEM AND ELECTRIC VEHICLE"

GENEVA, Dec. 22 -- SCHAEFFLER TECHNOLOGIES AG & CO. KG (IndustriestraBe 1-391074 Herzogenaurach) filed a patent application (PCT/EP2025/065201) for "THERMAL MODULE, INDIRECT HEAT TRANSPORT MEDIUM CIRCUIT (CYCLE) SYSTEM, AND ELECTRIC VEHICLE" on Jun 02, 2025. With publication no. WO/2025/256944, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ESER, Gerhard (c/o Vitesco Technologies GmbHLandsberger StraBe 187 - Haus D80687 Munchen), BRETTNER, Sebastian (c/o Vitesco Technologies GmbHLandsberger StraBe 187 - Haus D80687 Munch...