INTERNATIONAL PATENT: SCHAEFFLER TECHNOLOGIES AG & CO. KG FILES APPLICATION FOR "METHOD FOR PRODUCING AN ELECTRONIC MODULE/HEAT SINK ASSEMBLY AND INVERTER COMPRISING SUCH AN ELECTRONIC MODULE/HEAT SINK ASSEMBLY"

GENEVA, Dec. 22 -- SCHAEFFLER TECHNOLOGIES AG & CO. KG (IndustriestraBe 1-391074 Herzogenaurach) filed a patent application (PCT/EP2025/065805) for "METHOD FOR PRODUCING AN ELECTRONIC MODULE/HEAT SINK ASSEMBLY, AND INVERTER COMPRISING SUCH AN ELECTRONIC MODULE/HEAT SINK ASSEMBLY" on Jun 06, 2025. With publication no. WO/2025/257048, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KONIG, Enrico (c/o Vitesco Technologies GmbHLandsberger StraBe 187 - Haus D80687 Munchen), DITTRICH, Lars (c/o Vitesco Technologies GmbHLandsber...