GENEVA, Oct. 13 -- SANGO CO., LTD. (3-1, Mutsuno 1-chome, Atsuta-ku, Nagoya-shi, Aichi4560023), 株式会社三五 (愛知県名古屋市熱田区六野一丁目３番１号) filed a patent application (PCT/JP2025/001978) for "METHOD FOR ASSEMBLING PLATE-SHAPED COOLING DEVICE, PLATE-SHAPED COOLING DEVICE, AND CLAMP DEVICE" on Jan 23, 2025. With publication no. WO/2025/210986, the details related to the patent application was published on Oct 09, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizati...