INTERNATIONAL PATENT: SANDISK TECHNOLOGIES LLC FILES APPLICATION FOR "MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRUCTURES WHICH CONTACT PLURAL STACKS AND METHOD OF MAKING THE SAME"

GENEVA, March 4 -- SANDISK TECHNOLOGIES LLC (5080 Spectrum DriveSuite 1050WAddison, Texas 75001) filed a patent application (PCT/US2024/030893) for "MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRUCTURES WHICH CONTACT PLURAL STACKS AND METHOD OF MAKING THE SAME" on May 23, 2024. With publication no. WO/2025/042455, the details related to the patent application was published on Feb 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): OGAWA, Hiroyuki (c/o Western Digital Technologies, Inc.5601 Great Oaks ParkwaySan Jose, California 95119), TSUTSUMI, Masanori (c/o Western Digital Technologies, ...