INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRUCTURES AND METHODS FOR FORMING THE SAME"

GENEVA, Jan. 13 -- SANDISK TECHNOLOGIES, INC. (951 Sandisk DriveMilpitas, California 95035) filed a patent application (PCT/US2025/025944) for "THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRUCTURES AND METHODS FOR FORMING THE SAME" on Apr 23, 2025. With publication no. WO/2026/010665, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHU, Ruogu, Matthew (c/o Sandisk Technologies, Inc.951 Sandisk DriveMilpitas, California 95035), MATSUNO, Koichi (c/o Sandisk Technologies, Inc.951 Sandisk DriveMilpitas, Ca...