INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE CONTACT LAYER HAVING HORIZONTALLY AND VERTICALLY EXTENDING PORTIONS AND METHODS OF FORMING THE SAME"

GENEVA, March 4 -- SANDISK TECHNOLOGIES, INC. (951 Sandisk DriveMilpitas, California 95035) filed a patent application (PCT/US2024/031322) for "THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE CONTACT LAYER HAVING HORIZONTALLY AND VERTICALLY EXTENDING PORTIONS AND METHODS OF FORMING THE SAME" on May 28, 2024. With publication no. WO/2025/042457, the details related to the patent application was published on Feb 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TSUTSUMI, Masanori (c/o Western Digital Technologies, Inc.,5601 Great Oaks ParkwaySan Jose, California 95119), TANAKA, Hiroyuki (c/o Wes...