INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY DEVICE WITH ISOLATION TRENCH FILL STRUCTURE HAVING LATERALLY-UNDULATING SIDEWALLS AND METHOD OF MAKING THE SAME"

GENEVA, April 1 -- SANDISK TECHNOLOGIES, INC. (951 Sandisk DriveMilpitas, California 95035) filed a patent application (PCT/US2024/031016) for "THREE-DIMENSIONAL MEMORY DEVICE WITH ISOLATION TRENCH FILL STRUCTURE HAVING LATERALLY-UNDULATING SIDEWALLS AND METHOD OF MAKING THE SAME" on May 24, 2024. With publication no. WO/2025/064020, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHOU, Fei (c/o Western Digital Technologies, Inc.,5601 Great Oaks ParkwaySan Jose, California 95119), AMANO, Fumitaka (c/o Western Digital Tech...