INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MULTI-TIER TRENCH BRIDGE STRUCTURES AND METHODS FOR FORMING THE SAME"

GENEVA, Sept. 17 -- SANDISK TECHNOLOGIES, INC. (951 SanDisk DriveMilpitas, California 95035) filed a patent application (PCT/US2025/011171) for "THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MULTI-TIER TRENCH BRIDGE STRUCTURES AND METHODS FOR FORMING THE SAME" on Jan 10, 2025. With publication no. WO/2025/188404, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHIMIZU, Atsushi (951 SanDisk DriveMilpitas, California 95035), MURANAGA, Wataru (951 SanDisk DriveMilpitas, California 95035)

Abstract: A semiconductor structure in...