INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A DIELECTRIC SUPPORT ASSEMBLY WITH A DIELECTRIC CONNECTION PLATE AND METHOD OF MAKING THEREOF"

GENEVA, Aug. 19 -- SANDISK TECHNOLOGIES, INC. (951 SanDisk DriveMilpitas, California 95035) filed a patent application (PCT/US2025/011154) for "THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A DIELECTRIC SUPPORT ASSEMBLY WITH A DIELECTRIC CONNECTION PLATE AND METHOD OF MAKING THEREOF" on Jan 10, 2025. With publication no. WO/2025/170708, the details related to the patent application was published on Aug 14, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MATSUNO, Koichi (951 SanDisk DriveMilpitas, California 95035), ZHU, Ruogu Matthew (951 SanDisk DriveMilpitas, California 95035), ALSMEIER, Joha...