INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA STRUCTURES LOCATED ABOVE SUPPORT PILLAR STRUCTURES AND METHODS OF FORMING THE SAME"

GENEVA, March 10 -- SANDISK TECHNOLOGIES, INC. (951 Sandisk DriveMilpitas, California 95035) filed a patent application (PCT/US2024/030896) for "STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA STRUCTURES LOCATED ABOVE SUPPORT PILLAR STRUCTURES AND METHODS OF FORMING THE SAME" on May 23, 2024. With publication no. WO/2025/048917, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YU, Jixin (c/o Western Digital Technologies, Inc.,5601 Great Oaks ParkwaySan Jose, California 95119), MATSUNO, Koichi (c/o Western ...