INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND COUPLING THE BGA DEVICE TO A PRINTED CIRCUIT BOARD WITH LIMITED HEAT EXPOSURE"

GENEVA, March 10 -- SANDISK TECHNOLOGIES, INC. (951 Sandisk DriveMilpitas, CA 95035) filed a patent application (PCT/US2024/030895) for "INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND COUPLING THE BGA DEVICE TO A PRINTED CIRCUIT BOARD WITH LIMITED HEAT EXPOSURE" on May 23, 2024. With publication no. WO/2025/048916, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TSUR, Nadav (C/O Western Digital Technologies, Inc.5601 Great Oaks ParkwaySan Jose, California 95119), AKERMAN, Igor (C/O Western Digital Techn...