INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC., MAEKURA, TAKAYUKI FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY DEVICE WITH VARIABLE WORD LINE VIA CONTACT DENSITY AS FUNCTION OF CONTACT DEPTH AND METHODS OF FORMING THE SAME"

GENEVA, June 11 -- SANDISK TECHNOLOGIES, INC. (951 Sandisk DriveMilpitas, CA 95035), MAEKURA, Takayuki (c/o Western Digital Technologies, Inc.5601 Great Oaks ParkwaySan Jose, CA 95119) filed a patent application (PCT/US2024/040249) for "THREE-DIMENSIONAL MEMORY DEVICE WITH VARIABLE WORD LINE VIA CONTACT DENSITY AS FUNCTION OF CONTACT DEPTH AND METHODS OF FORMING THE SAME" on Jul 30, 2024. With publication no. WO/2025/116992, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KUBO, Tomohiro (c/o Western Digital Technologies, ...