INTERNATIONAL PATENT: SAMSUNG SDI CO., LTD., 삼성에스디아이 주식회사 FILES APPLICATION FOR "LASER ETCHING APPARATUS AND METHOD FOR WELDING CAN AND CAP ASSEMBLY"

GENEVA, Nov. 11 -- SAMSUNG SDI CO., LTD. (150-20 Gongse-ro, Giheung-GuYongin-SiGyeonggi-do 17084), 삼성에스디아이 주식회사 (경기도용인시기흥구 공세로 150-20) filed a patent application (PCT/KR2024/008635) for "LASER ETCHING APPARATUS AND METHOD FOR WELDING CAN AND CAP ASSEMBLY" on Jun 21, 2024. With publication no. WO/2025/230032, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): EOM, Hee...