INTERNATIONAL PATENT: SAMSUNG ELECTRONICS CO., LTD. FILES APPLICATION FOR "METHOD AND DEVICE FOR MULTI-SIM UE TO MANAGE COLLIDING GAPS IN NEXT GENERATION MOBILE COMMUNICATION SYSTEM"

GENEVA, April 7 -- SAMSUNG ELECTRONICS CO., LTD. (129, Samsung-ro,Yeongtong-gu, Suwon-si,Gyeonggi-do 16677) filed a patent application (PCT/KR2024/014742) for "METHOD AND DEVICE FOR MULTI-SIM UE TO MANAGE COLLIDING GAPS IN NEXT GENERATION MOBILE COMMUNICATION SYSTEM" on Sep 27, 2024. With publication no. WO/2025/071340, the details related to the patent application was published on Apr 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JUNG, Sangyeob (129, Samsung-ro,Yeongtong-gu, Suwon-si,Gyeonggi-do 16677)

Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G)...