INTERNATIONAL PATENT: SAMSUNG ELECTRONICS CO., LTD. FILES APPLICATION FOR "METHOD AND APPARATUS FOR SUPPORT A SLICING IN A WIRELESS COMMUNICATION SYSTEM"

GENEVA, May 13 -- SAMSUNG ELECTRONICS CO., LTD. (129, Samsung-ro, Yeongtong-guSuwon-siGyeonggi-do 16677) filed a patent application (PCT/KR2024/016399) for "METHOD AND APPARATUS FOR SUPPORT A SLICING IN A WIRELESS COMMUNICATION SYSTEM" on Oct 25, 2024. With publication no. WO/2025/095476, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WANG, Yanru (1503, 15 Floor, Building No12Taiyanggong Middle Road,Chaoyang district, Beijing 100028), XU, Lixiang (1503, 15 Floor, Building No12Taiyanggong Middle Road,Chaoyang district, Be...