INTERNATIONAL PATENT: SAMSUNG ELECTRONICS CO., LTD. FILES APPLICATION FOR "METHOD AND APPARATUS FOR SLICE MANAGEMENT IN WIRELESS COMMUNICATION SYSTEM"

GENEVA, March 4 -- SAMSUNG ELECTRONICS CO., LTD. (129, Samsung-ro, Yeongtong-guSuwon-siGyeonggi-do 16677) filed a patent application (PCT/KR2024/096027) for "METHOD AND APPARATUS FOR SLICE MANAGEMENT IN WIRELESS COMMUNICATION SYSTEM" on Aug 20, 2024. With publication no. WO/2025/042263, the details related to the patent application was published on Feb 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WATFA, Mahmoud (Samsung R&D Institute UKCommunications House, South StreetStaines Middlesex TW18 4QE), KUMAR, Lalith (#2870, Phoenix BuildingBagmane Constellation Business ParkOuter Ring Road...