INTERNATIONAL PATENT: SAMSUNG ELECTRONICS CO., LTD., 삼성전자 주식회사 FILES APPLICATION FOR "METHOD AND DEVICE PERTAINING TO INTER-CU L1/L2 LAYER-BASED MOBILITY IN NEXT GENERATION MOBILE COMMUNICATION SYSTEM"

GENEVA, Aug. 25 -- SAMSUNG ELECTRONICS CO., LTD. (129, Samsung-ro,Yeongtong-gu, Suwon-si,Gyeonggi-do 16677), 삼성전자 주식회사 (경기도수원시 영통구삼성로 129) filed a patent application (PCT/KR2025/001922) for "METHOD AND DEVICE PERTAINING TO INTER-CU L1/L2 LAYER-BASED MOBILITY IN NEXT GENERATION MOBILE COMMUNICATION SYSTEM" on Feb 10, 2025. With publication no. WO/2025/174010, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization ...