INTERNATIONAL PATENT: SAMSUNG ELECTRONICS CO., LTD., 삼성전자 주식회사 FILES APPLICATION FOR "EXTRUSION DIE COMPRISING MULTIPLE NOZZLE PIECES"

GENEVA, Oct. 5 -- SAMSUNG ELECTRONICS CO., LTD. (129, Samsung-roYeongtong-gu, Suwon-siGyeonggi-do 16677), 삼성전자 주식회사 (경기도수원시 영통구삼성로 129) filed a patent application (PCT/KR2025/099234) for "EXTRUSION DIE COMPRISING MULTIPLE NOZZLE PIECES" on Feb 04, 2025. With publication no. WO/2025/206912, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HAN, Jungmoo (129, Samsung-roYeongtong-gu, Suwon...