INTERNATIONAL PATENT: SAMSUNG E&A CO.,LTD., 삼성이앤에이(주) FILES APPLICATION FOR "WELDING MODULE FOR WELDING ROBOT, WELDING ROBOT AND AUTOMATIC WELDING METHOD"

GENEVA, Oct. 28 -- SAMSUNG E&A CO.,LTD. (26, Sangil-ro 6-gil,Gangdong-gu,Seoul 05288), 삼성이앤에이(주) (서울특별시강동구상일로6길 26) filed a patent application (PCT/KR2024/019177) for "WELDING MODULE FOR WELDING ROBOT, WELDING ROBOT, AND AUTOMATIC WELDING METHOD" on Nov 28, 2024. With publication no. WO/2025/220828, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Dae Hwan (26, Sangil-ro 6-gil,Gangdong-g...