GENEVA, Jan. 13 -- SAITO SEIKI CO.,LTD. (21-18, Fuchinobe 1-chome, Chuo-ku, Sagamihara-shi, Kanagawa2520206), 齊藤精機株式会社 (神奈川県相模原市中央区淵野辺一丁目２１番１８号) filed a patent application (PCT/JP2024/023909) for "GRIPPING DEVICE IN WORKPIECE GRINDING APPARATUS" on Jul 02, 2024. With publication no. WO/2026/009312, the details related to the patent application was published on Jan 08, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Proper...