GENEVA, Oct. 14 -- S-VANCE LTD. (62-1 Nomuranakamachi, Hirakata-city, Osaka5730144), エスバンス株式会社 (大阪府枚方市野村中町６２番１号) filed a patent application (PCT/JP2025/013643) for "INJECTION MOLDING DEVICE" on Apr 03, 2025. With publication no. WO/2025/211420, the details related to the patent application was published on Oct 09, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KINOSHITA, Takatoshi (c/o S-VANCE LTD., 62-1 Nomuranakamachi, Hira...